Gold-coated glass slides, mica, silicon wafers, coverslips

• Our gold-coated substrates offer enable you to:
  • Avoid paying clean room access fees
  • Avoid contamination problems from multi-user evaporators
  • Avoid reproducibility problems

• Features Include:
  • Plasma-cleaned surfaces
  • Electron-beam deposited metal films
  • Titanium adhesion layer
  • Prepared in a dedicated clean environment
  • Availability of ellipsometric constants

Gold Substrates Download          New Stripped Gold Chips   

View All Available Substrates

Code & Pricing	Product Description	Qty
AU.0100.ALSI	Aluminosilicate Glass Slides Coated with 100 A Au 1' x 3' x 0.7mm 100 A Au over 20 A Ti Adhesion Layer	5
AU.0500.ALSI	Aluminosilicate Glass Slides Coated with 500 A Au 1' x 3' x 0.7mm 500 A Au over 25 A Ti Adhesion Layer	5
AU.1000.ALSI	Aluminosilicate Glass Slides Coated with 1000 A Au 1' x 3' x 0.7mm 1000 A Au over 50 A Ti Adhesion Layer	5
AU.0100.CSS	Coverslips Coated with 100 A Au 22mm square, 0.13 to 0.16mm thickness 100 A Au over Titanium adhesion layer	12
AU.0500.CSS	Coverslips Coated with 500 A Au 22mm square, 0.13 to 0.16mm thickness 500 A Au over Titanium adhesion layer	12
AU.0100.CSR	Coverslips Coated with 100 A Au 15mm round, 0.13 to 0.16mm thickness 100 A Au over Titanium adhesion layer	24
AU.2000.MC1	Mica Coated with 2000 A Au (small) 1' x 1.5' mica	1
AU.2000.MC2	Mica Coated with 2000 A Au (large) 1' x 3' mica	1
AU.1000.SL1	Silicon Wafers Coated with 1000 A Au 4' diameter, 525um thickness 1000 A Au over 50A Ti adhesion layer	3
AU.1000.SL2	Silicon Wafers Coated with 1000 A Au 4' diameter, 525um thickness 1000 A Au over 50A Ti adhesion layer	12
AU.2000.MTSG	Template Stripped Gold Chips - Mica 1cm x 1cm glass chips adhered to a 2000 A gold-coated piece of mica	5
AU.1000.SWTSG	Template Stripped Gold Chips - Silicon Wafer 1cm x 1cm glass chips adhered to 1000A gold-coated prime grade silicon wafer	20

Applications:

Cell Culture
Substrates are prepared in an electron beam evaporator that is solely dedicated to the deposition of gold films. This prevents the occurrence of impurity metals (e.g., trace levels of Cu) contaminating the gold films, as is the case when multi-user equipment is used to coat gold substrates

Microarrays
Substrates are prepared in an electron beam evaporator using titanium, not chromium, as the adhesion layer. This avoids the contamination that can occur when a thin layer of chromium is used to promote adhesion of the gold film to an underlying substrate (such as a glass microscope slide), since chromium readily dissolves and diffuses to the surface of the gold film (and can adversely modify the reactivity of the gold).

Surface Plasmon Reflectometry
Substrates are deposited using an electron beam evaporator, which permits precise control of gold deposition rates and thus the surface roughness. This ensures a high level of control over the thickness and nanometer-scale surface roughness of gold films, as is necessary in order to generate reproducible results with surface plasmon reflectometry.

Scanning Probe Microscopy
Substrates deposited on mica can be thermally annealed or transferred to epoxy resin (reverse mounting) to form atomically flat surfaces suitable for scanning probe microscopy.